BUSINESS

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Process chain of development

To realize new design, new material, new finishing process, we need more accurate CAE results…

How to improve accuracy of CAE results

Digitizing of multi-operated stamping

Issues

3D Scanner ATOS

Assembly error because of springback after multi-stamping operations

  • Front cover of camera
  • Material : aluminum
  • Multi- stamping processes

Resolve

3D Scanner ATOS

Digitizing all of stamped products → Analysis and Identification → CAE optimization → Re-design of mold

Full field 3D scan data

Issues

3D Scanner ATOS

  • Mg bracket in mobile phone
  • Manufacturing process : Mg Die Casting
  • Shrinkage deformation duet to different cooling rate
  • Try out and modify empirically

Resolve

3D Scanner ATOS
  • MScan 3D deformation and Analyse
  • Determination of quantitative modification using full field 3D data. where? and how?

A3 size printer

Issues

3D Scanner ATOS
  • Goal : 20% lightweight, 20% cheaper! But same quality
  • Material : HSS350(High Stength Steel)
  • Bottom plate of A3 sized Printer must be very flat.
  • Higher strength, higher springback proportionally

Resolve

3D Scanner ATOS
  • 3D scan and analysis of springback deformation : two sheet materials
  • CAE comparision and parameter optimization
  • Optimized component design and die design for reduction of springback

LCD Bottom Chassis

Issues

Improvement of CAE accuracy by simulation parameter tuning (42%→80%)

Optimized flat bead design

3D Scanner ATOS
  • Optimization of flat-beads to reduce springback
  • Design variables : Positions, Length, Shape

Pontos measurement during stamping

Issues

3D Scanner ATOS
  • Goal : Identification molds problems

Resolve

3D Scanner ATOS
  • Detection of deformation on loading condition during stamping with Pontos
  • Molds are not flat horizotally but deformed on the impacting moment
  • Reduce the die deformation with new process sequence design considering load distribution
  • Determination of mold material and mold size

Analysis of high speed stamping mold(1)

Issues

3D Scanner ATOS
  • Semiconductor lead frame , lead pitch : 100um
  • Stamping speed (SPM : Stroke per Minute) 250, 350 and 450 SPM
  • The length of progresive die is about 3m and C/T is about 0.1~0.2 sec. Measured with

Resolve

3D Scanner ATOS
  • Determination of maximum stamping speed [SPM] in order to improve cutting quality
  • Optimization of mold structure (size, material and tolerances between molds)

Analysis of high speed stamping mold(2)

Conclusion

Gom is a total solution from design to mass production over the entire product development